Properties and numerical solutions of dispersion curves in general isotropic waveguides

In this paper, some properties of dispersion curves in general isotropic piecewise homogeneous waveguides are rigorously derived. These properties are leveraged in a numerical implementation capable of determining the dispersion curves of such waveguides with cross-section materials that can be highly conductive (such as copper). In a numerical example, the influence of a lossy shielding conductor on the complex modes of a shielded dielectric image guide is investigated for the first time

Accurate 2D MoM technique for arbitrary dielectric, magnetic and conducting media applied to shielding problems

Calculating interaction integrals in a Method of Moments technique is highly challenging in a conductive medium. The specific form of its wave number leads to a strongly oscillating and exponentially damped Green's function, making standard numerical evaluation schemes inapt to accurately evaluate the interaction integrals. In this paper, we present an accurate 2D Method of Moments technique for arbitrary dielectric, magnetic and conducting media and apply the method to solve shielding problems

Accurate 2.5-D boundary element method for conductive media

The solution of the time-harmonic Maxwell equations using a boundary element method, for 2-D geometries illuminated by arbitrary 3-D excitations, gives rise to numerical difficulties if highly conductive media are present. In particular, the interaction integrals arising in the method of moments involve kernels that strongly oscillate in space and, at the same time, decay exponentially. We present an accurate method to tackle these issues over a very broad conductivity range (from lossy dielectric to conductor skin-effect regime), for both magnetic and nonmagnetic conductors. Important applications are the modal analysis of waveguides with nonperfect conductors, scattering problems, and shielding problems with enclosures with arbitrary permeability and conductivity and 3-D noise sources

Analytic properties of dispersion curves for efficient eigenmode analysis of isotropic waveguides using a boundary element method

Recent developments in high-speed interconnects show a clear tendency towards higher bitrates, emphasizing the need for a reliable prediction of the waveguide behavior. We present a frequency domain eigenmode analysis of isotropic waveguides using a boundary element method. Some properties of the dispersion curves can be beneficially leveraged into the numerical framework for calculating the waveguide characteristics as a function of frequency. The method allows the incorporation of highly conductive materials, which is demonstrated in a numerical example

Analytic properties of dispersion curves for efficient eigenmode analysis of isotropic waveguides using a boundary element method

Recent developments in high-speed interconnects show a clear tendency towards higher bitrates, emphasizing the need for a reliable prediction of the waveguide behavior. We present a frequency domain eigenmode analysis of isotropic waveguides using a boundary element method. Some properties of the dispersion curves can be beneficially leveraged into the numerical framework for calculating the waveguide characteristics as a function of frequency. The method allows the incorporation of highly conductive materials, which is demonstrated in a numerical example

A paper-white chip-based display MCM package for portable IT products

Recently we have developed a direct View reflective CMOS active matrix (AM) polymer dispersed (PD) liquid crystal (LC) display. A 3 mu m 15 V CMOS technology for the silicon backplane was chosen for its voltage compatibility with PDLC. The main features of this display ape: 1/16 VGA resolution, pixel size 80 mu m, response time suited for all video applications, integrated analog scanner circuits and fully integrated row drivers, a low cost back-end module for defining the pixel pads and light shielding, and a non-vacuum PDLC filling assembly technology. A LVDS (low voltage differential signalling) link was chosen for the interfacing. Therefore a ceramic package was developed which contains the display chip plus other electronic components, including a LVDS receiver, a voltage step-up converter, a digital to analog converter and a video amplifier. This very simple interfacing (one 5V voltage supply and 3 signal pairs) and the low power consumption (750 mW) for the whole light weight package, makes this display system compatible with personal and mobile IT applications